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Micron countersues Tessera in chip package suit SAN FRANCISCO (Reuters) - Micron Technology Inc. (MU.N: Quote, Profile, Research), a maker of computer memory chips, countersued Tessera Technologies Inc. (TSRA.O: Quote, Profile, Research) in June, three months after Tessera sued Micron for patent infringement and anticompetitive conduct, Micron said on Thursday. In a filing with the U.S. Securities and Exchange Commission, Micron said it filed the counterclaims on June 22, alleging infringement of eight Micron patents by Tessera, which licenses microchip packaging technology. Micron also asked the U.S. district court in Eastern Texas to declare that it did not infringe on Tessera patents. Tessera, based in San Jose, California, licenses its technology to many of the world's largest chip companies, including Intel Corp. (INTC.O: Quote, Profile, Research), Samsung Electronics Co. Ltd. (005930.KS: Quote, Profile, Research) and Texas Instruments Inc. (TXN.N: Quote, Profile, Research) On March 1, the company sued Micron and Infineon Technologies AG (IFXGn.DE: Quote, Profile, Research) for patent infringement, alleging that their memory chips infringe on Tessera patents for chip packaging. Chip packages are the interface between the semiconductor components and the systems they operate, and also protect chips from damage and contamination. News Sourcehttp://www.microsite.reuters.com
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